发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent destruction of electrodes due to discharge by the use of a simple means in the surface acoustic wave device adopting a face-down connection structure. SOLUTION: The surface acoustic wave device has a surface acoustic wave element and a housing package. The package consists of a package base 2 and a conductor pattern formed on the surface of the package base 2, and the conductor pattern and an input terminal. An output terminal and a ground terminal of the surface acoustic wave element are connected via a conductive bump in this face-down connection type surface acoustic wave device. Furthermore, in this surface acoustic wave device, conductor patterns 221, 222, 223 connecting with the input terminal, the output terminal and the ground terminal of the surface acoustic wave element are connected electrically by one resistor 23 in the package.
申请公布号 JP2000031783(A) 申请公布日期 2000.01.28
申请号 JP19980211786 申请日期 1998.07.10
申请人 TDK CORP 发明人 OSANAI KATSUNORI
分类号 H03H9/145;H03H9/25;(IPC1-7):H03H9/25 主分类号 H03H9/145
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