发明名称 HEAT SEAL JUNCTION METHOD AND TAB STRUCTURE
摘要 PROBLEM TO BE SOLVED: To avoid the decline in the long term reliability due to the water content in air by removing the gap between the TAB copper patterns in the press fitting part of a heat seal junction. SOLUTION: The thickness of the copper patterns 109 in the TAB junction is made thinner than that in the regions excluding the junction i.e., the thickness to the extent of sufficiently filling up the gaps between adjacent copper patterns 109 with an adhesive so that, when the copper patterns 109 are junctioned by the thermal pressure fixing process etc., the gaps between the adjacent copper patterns 109 may be removed.
申请公布号 JP2000031214(A) 申请公布日期 2000.01.28
申请号 JP19980192138 申请日期 1998.07.07
申请人 SEIKO EPSON CORP 发明人 YAMAKAWA KAZUHIKO
分类号 H05K1/14;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K1/14
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