| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump forming apparatus, with which the temperature control different from the conventional one is performed when a bump is formed on a semiconductor wafer, and to provide the bump forming method performed on the bump forming apparatus. SOLUTION: This bump forming apparatus 101 is provided with a transfer device 140 and a control device 180, and after formation of a bump which is held by the transferring device, a wafer 202 is arranged above the bonding stage, and the temperature drop of the wafer is controlled. As a result, the generation of nonconformities such as cracks, etc., caused by thermal stresses can be prevented even for a compound semiconductor wafer which is sensitive to the change of temperature.
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