| 摘要 |
PROBLEM TO BE SOLVED: To stably mount a semiconductor device on a mother board through solder balls at a low cost regardless of the warping state of the device by providing a surface mount jig which supports the semiconductor device separately from a mother board at the time of reflowing the solder balls between the mother board and semiconductor device. SOLUTION: A surface mount jig 1 which is used for supporting an intermediate board 3 is provided on a mother board 4 having board pads 8 and solder balls 2 are formed on the rear surface of the intermediate board 3 to which a semiconductor chip 6 is bonded with a mount material 7. At the time of bonding the intermediate board 3 to the mother board 4, solder balls are sufficiently melted by prolonging the reflow heating time or raising the temperature. At the time of bonding the board 3 to the board 4, in addition, the occurrence of such a state that the solder balls 2 are crushed and protrude from the board pads 8 is avoided by supporting the board 3 by the surface mount jig 1 from four sides. Therefore, the intermediate board 3 can be easily arranged on a prescribed position of the mother board 4 by means of the jig 1. |
