| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent shortcircuiting generated by a contact between inner leads and between an inner lead and a part other than a projecting electrode, by applying insulating resin which is excellent in flexibility to an inner lead which is not in contact with a bonding tool and a bump electrode of a semiconductor element and a gap part thereof. SOLUTION: A copper foil laminated on a 50 to 125μm-thick polyimide base film 1 is etched and an inner lead 2 is formed. Then, flexible polyimide insulating resin 4 is formed 5 to 40μm thick in a lower surface of the inner lead 2 and a gap part thereof. Since the insulating resin 4 exists in an inner lead gap, an inner lead is fixed and inner leads do not come into contact with each other. Furthermore, since there is the insulating resin 4 between the inner lead 2 and a semiconductor element 5, shortcircuiting is not caused even if an inner lead comes into contact with a part except a bump electrode 5a of the semiconductor element 5 during bonding.</p> |
