| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a resin coat inside a solder bank by forming the solder bank by sticking solder onto an annular conductive pattern surrounding a semiconductor chip mounting position. SOLUTION: When cream solder is melted in a reflowing furnace, the solder spreads throughout a conductive pattern 16 for bank due to its wettability and, after reflowing, a crystal oscillator 8 and a chip capacitor 9 are mounted on a substrate 7 and, at the same time, a projecting solder bank 12 is formed on the pattern 16. Then the produced flux residue and solder splashes are cleaned off and a semiconductor chip is mounted on the substrate 7 and electrically connected to the substrate by wire bonding. After the chip is electrically connected to the substrate 7, a resin coat is formed so as to cover the chip inside the solder bank by discharging and curing a resin. Therefore, the mass production of electronic components can be realized easily, because the forming time of the resin coat can be shortened remarkably without requiring the addition of a special facility to the production facility.</p> |
