SEALING METHOD OF IC CHIP WITH BUMP

摘要

PROBLEM TO BE SOLVED: To provide a sealing method of an IC chip capable of improving the productivity and cutting down the filling time of the gap between the IC chip with bump and a circuit board with a sealing resin. SOLUTION: In the sealing step of an IC chip 21 after connecting the IC chip 21 with a bump 22 to the wiring pattern of a circuit board 23 by the flip process, the preprocessing is performed by hole making in the circuit board 23 for filling a sealing resin 25 through the hole H1 thereby enabling the time for filling the entire gap between the IC chip 21 and the circuit board 23 to be cut down.