| 摘要 |
PROBLEM TO BE SOLVED: To improve the precision of the detection of an alignment mark when only a representative shot area is used, by obtaining the alignment positions of a plurality of shot areas on a substrate through the use of an error parameter, based on measured position information and design position information of the representative shot area on the substrate. SOLUTION: Alignment marks (GY0, SX0 and SY0) and (GY6, SX6 and SY6) following representative alignment shot areas C0 and C6 in a plurality of chip (shot) areas formed on a substrate WA are detected, and measured position information of the alignment shot areas C0 and C6 are decided. An error parameter specifying the array characteristics of a plurality of shot areas C0... on the substrate WA is calculated by using respective pieces of design position information and measurement position information of the alignment shot areas C0 and C6. The relative alignment positions of the shot areas C0... with respective circuit pattern images are decided, based on the error parameter.
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