FABRICATION OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a fabrication method of semiconductor wafer in which accuracy is enhanced at beveled part by performing a beveling step following to at least one time of both sides simultaneous surface grinding. SOLUTION: The method for fabricating a semiconductor wafer comprise step E for slicing single crystal ingot to obtain a thin disc-like wafer, a step for planarizing the wafer surface by surface grinding, a step K for beveling the outer circumferential edge part of the wafer, and a step K for mirror finishing the wafer surface. The inventive method further comprises a step for grinding the opposite sides of the wafer simultaneously by means of a both side grinding machine in order to remove waving of the wafer prior to the beveling step and beveling accuracy is enhanced by performing secondary grinding step of single or both side simultaneous grinding following to the beveling step.