| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic component which is sealed with a recyclable sealant component which protects an electronic component and its metalized coat from corrosion, in an environment, and mechanical damage. SOLUTION: Related to a method for manufacturing an electronic assembly of an under-fill sealing agent component which is curable and recyclable, provided between an electronic component and a substrate, (a) an under-fill sealing agent component is prepared which is formed by combination of components comprising (i) at least one kind of reactive oligoner kind or prepolymer kind which is selected among mono-functional maleimide compound, mono-functional vinyl compound other than maleimide compound, and combination of mono- functional maleimide compound and mono-functional vinyl compound, and (ii) a cure initiator selected among free radical initiator, photo initiator, and combination of free radical initiator and photo initiator. (b) the curable component is provided between an electronic component and a substrate, and (c) the component is cured in situ. |
