发明名称 CMOS INTEGRATED CIRCUIT CHIP
摘要 PROBLEM TO BE SOLVED: To make a chip flexibly conformable and adjustable to different applications, enable bandwidth compression of a digitized image, perform correlation processing of a present image and a just preceding image through a digital processing on a chip, and optimize design to high density CMOS structure. SOLUTION: In a chip 100 of a single CMOS integrated circuit, an optical cell array 112 takes in an image and forms a corresponding analog signal, and a converting circuit 120 converts the analog signal into a digital signal. A correlation circuit 140 processes the digital signal, and forms a result plane having a minimum value showing the optimum image displacement between the taken-in image and the just preceding image. An interface circuit 160 formats the digital signal from the converting circuit 120, imparts compatibility to signal communication to a previously selected device, and sends out the signal.
申请公布号 JP2000031390(A) 申请公布日期 2000.01.28
申请号 JP19990066921 申请日期 1999.03.12
申请人 HEWLETT PACKARD CO <HP> 发明人 BADYAL RAJEEV;KNEE DEREK L;MARK A ANDERSON;BRIAN J MISEK
分类号 H01L21/822;H01L27/04;H01L27/146;H04N5/232;H04N5/335;(IPC1-7):H01L27/04 主分类号 H01L21/822
代理机构 代理人
主权项
地址