发明名称 CERAMICS-METAL JUNCTION BOARD WITH HEAT AND IMPACT RESISTANCE
摘要 PROBLEM TO BE SOLVED: To provide a ceramics-metal junction board having heat and impact resistance and used reliably as an insulating circuit board for mounting a power device. SOLUTION: A tough pitch copper plate 2 with a thickness of 0.25 mm on a circuit side a tough pitch copper plate 2 with a thickness of 0.2 mm on a heat-sink side, and a conventional aluminum 22 mm square board as a ceramic member are prepared. The copper plate 2 is put in contact with the main face of the aluminum board 1 and heated and cooled under an atmosphere with inert gas to form a junction body. One copper face plate 2 on the circuit side in the junction body is formed into a given patterned shape with an uneven pattern with an edge width of 0.3 mm, an interval of 0.25 mm, and a length of 0.5 mm. Then, the heat-sink side of the junction body is etched into the same pattern as the copper plate 2 on the circuit side.
申请公布号 JP2000031359(A) 申请公布日期 2000.01.28
申请号 JP19990179342 申请日期 1999.06.25
申请人 DOWA MINING CO LTD 发明人 KIMURA MASAMI;NEI GYOSAN;KOHATA TETSUO
分类号 H01L23/12;H01L23/373;H05K1/02;(IPC1-7):H01L23/373 主分类号 H01L23/12
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