发明名称 LED AGGREGATE MODULE
摘要 PROBLEM TO BE SOLVED: To move heat generated from a LED or a LED element efficiently, also release outside, and restrict down a temperature of the LED or the LED element by a method wherein an elastic plate having high heat conductivity is disposed between one face of a stand and the other face of an insulation substrate. SOLUTION: If a current flows in a LED 4, a LED element heats the LED 4 by a Joule heat, and this heat transmits to an insulation substrate 2 by conduction. Furthermore, heat transfers from this insulation substrate 2 to a stand 1 by conduction. The heat transfers is conducted smoothly from this insulation substrate 2 to the stand 1 by close adhesion of a rubber 5 between the stand 1 and the insulation substrate 2, and the heat transferring to the stand 1 diffuses to the stand 1. Thus, the heat conduction to the stand 1 is executed efficiently and also the heat transferred to the stand 1 can be diffused to the entire stand 1 for a short time. Furthermore, the heat released from the LED 4 is released efficiently and externally, and as a result, the temperature of the LED 4 is restricted down.
申请公布号 JP2000031546(A) 申请公布日期 2000.01.28
申请号 JP19980193048 申请日期 1998.07.08
申请人 MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC LIGHTING CORP 发明人 ISHII KENICHI;MYODO SHIGERU;IMAI YASUO;KOBAYASHI TAKASHI
分类号 F21V29/00;F21V29/02;H01L25/075;H01L33/56;H01L33/64 主分类号 F21V29/00
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