发明名称 MANUFACTURE OF DIELECTRIC THIN FILM CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a small-sized dielectric thin film capacitor having large capacitance and a high breakdown voltage. SOLUTION: A titanium film 12 deposited by a sputtering method, and a lower part electrode composed of a platinum film 13 are formed on a silicon substrate 11. The surface of the electrode is roughened by a method like mechanical polishing. On the roughened surface, a dielectric film 14 of an ATO film formed by alternately laminating alumina and titania by an atomic layer epitaxy method is deposited. By depositing again a platinum film 15, an upper part electrode is formed.
申请公布号 JP2000031387(A) 申请公布日期 2000.01.28
申请号 JP19980198524 申请日期 1998.07.14
申请人 FUJI ELECTRIC CO LTD 发明人 KATO HISATO;KUSAKAWA KAZUHIRO;KAWAMURA YUKINORI
分类号 H01G4/33;H01L21/316;H01L21/822;H01L27/04;(IPC1-7):H01L27/04 主分类号 H01G4/33
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