| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit device that can effectively radiate heat from a semiconductor element being heated such as a high-frequency semiconductor element, etc., and can be packaged or mounted in a compact size. SOLUTION: There are provided a semiconductor chip 15 on the surface of which a semiconductor element 21 and a plurality of bumps 16A, 16B are formed, a first substrate 11 and a second substrate 12 wherein a passive element 18 is formed on one main surface and a metal layer for heat radiation is formed on the other main surface. The rear surface of the semiconductor chip 15 is connected with one main surface of the first substrate 11 via the metal layer 14, and the surface of the semiconductor chip 15 is connected with the passive element 18 and the metal layer 13 for heat radiation via the bumps 16 to constitute a integrated circuit device 10. |
