发明名称 LD MODULE
摘要 PROBLEM TO BE SOLVED: To remarkably reduce power consumption of electronic cooling element and total power consumption of LD module by mounting, on a single electronic cooling element, a plurality of LD elements, a condensing lens, a monitor PD as a light receiving element for monitoring output beam of LD and a thermistor resistance. SOLUTION: Two sets of LD (semiconductor laser) 10a, 10b are fixed in parallel on an electronic cooling element 21 and is formed through each sleeve 23 and fibers 19a, 19b. A-light receiving element (PD) 13a for monitoring the emitted light beam of LD 10a, thermistor resistance 15a and condensing lens 11a are fixed in direct on a metal substrate 14a. The light emitted from LD 10a is adjusted to obtain the maximum coupling coefficient for the condensing lens 11a and moreover temperature rise by generation of heat from LD 10a is detected by a thermistor resistance 15a and the part on the metal substrate 14a is cooled from the side of electronic cooling element 21. In the same manner, heat generated by LD 10b is also cooled by the metal substrate 14b and it is then radiated via a case 22.
申请公布号 JP2000031575(A) 申请公布日期 2000.01.28
申请号 JP19980194461 申请日期 1998.07.09
申请人 OKI ELECTRIC IND CO LTD 发明人 FUKUZAKI IKUO
分类号 G02B6/42;H01S3/04;H01S3/06;H01S5/00;H01S5/024;H01S5/30;(IPC1-7):H01S5/024 主分类号 G02B6/42
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