| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of an arm module for bridge circuits for use in DC-AC inverters and the like, wherein heat radiating efficiency is enhanced and further a surge voltage is reduced. SOLUTION: A current supplied to a positive electrode is supplied to a semiconductor chip 14 through a copper plate 20 and a wire 31, and it is further supplied from the semiconductor chip 14 to a middle point A1 through a wire 32, a copper plate 28, a rod 25 for welding and a copper plate 22. This current flows in opposite directions in positions very close to each other in the copper plates 20 and 22 and the like to prevent the occurrence of inductance. The current which has flown to the middle point A1 from a load is passed through the copper plate 22, a wire 34 and a semiconductor chip 15, and it further flows from the semiconductor chip 15 to a negative electrode through a wire 35 and a copper plate 21. This current flows in opposite directions in positions very close to each other in the copper plates 21 and 22, for example, to prevent the occurrence of inductance. |
