| 摘要 |
PROBLEM TO BE SOLVED: To lower the overall cost for the manufacturing process of semiconductor devices and to shorten manufacturing time. SOLUTION: A linear semiconductor raw material 30, having a thin film and a resist film formed on its surface is conveyed at a constant speed by rotating rollers 142 and 144. An aligner 140 is provided between the rollers 142 and 144. The aligner 140 is equipped with a laser light emitting part 152 and a 3rd drive part 154. The 3rd drive part 154 rotates the laser light emitting part 152 around the linear semiconductor raw material 30, and at the same time, a circuit pattern is drawn on the linear semiconductor 30 with a laser beam. The linear semiconductor 30 with the circuit pattern drawn is developed and etched to form a circuit, which is cut to a fixed length. Thus, a semiconductor device is manufactured by using the linear semiconductor raw material 30 of a fixed length. |
