发明名称 SOLID-STATE IMAGE PICK-UP DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent clamp defects by installing signal lines connected respectively to some of electrodes for a photosensitive pixel section selected from a plurality of them and to some of electrodes for a light shielding pixel section selected from a plurality of them. SOLUTION: On the surface of an N- layer 5 within a photosensitive pixel section 1, a plurality of P- regions 6 are formed at equal intervals. Electrodes 7a, 7b for a photosensitive pixel section are installed alternately on the P- regions 6. Electrodes 7c, 7d for a light shielding pixel section having the same shape as that of the electrodes 7a, 7b are installed alternately on an N- layer 5 within a light shielding pixel section 2. The electrodes 7a for a photosensitive pixel section and the electrodes 7d for a light shielding pixel section are connected with aϕH1 signal line 8a which is a common signal line. The electrodes 7b for a photosensitive pixel section are connected with aϕH2PD signal line 8b as a signal line for the photo sensitive pixel section. The electrodes 7c for a light shielding pixel section is connected with aϕH2OPB signal line 8c as a signal line for the light shielding pixel section.
申请公布号 JP2000031457(A) 申请公布日期 2000.01.28
申请号 JP19980198407 申请日期 1998.07.14
申请人 NEC CORP 发明人 FUTAMURA FUMIAKI
分类号 H01L27/148;H04N5/335;H04N5/341;H04N5/357;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
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