| 摘要 |
PROBLEM TO BE SOLVED: To form several tens of thousand of bumps collectively over a large area of a wafer, or the like, by transferring arranged solder balls to a wafer or an electronic part coated with highly adhesive flux and securing the solder balls temporarily and then subjecting the solder balls to thermal reflow while covering with a soft material and pressing into integral structure. SOLUTION: A solder ball arranging jig corresponding to several tens of thousand of positions for forming bumps, i.e., contact pads 2, of a wafer 1 is used, along with a shaker, for arranging solder balls 3. The wafer 1 is then coated with highly adhesive flux and the arranging solder balls 3 are transferred onto the wafer 1 using the flux 21 as adhesive. Subsequently, a sheet-like soft material 61 is translated onto the solder balls 3 on the wafer 1 to cover the entire surface thereof and pressed perpendicularly to the surface of the wafer 1. Finally, thermal reflow is performed while keeping that state.
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