| 摘要 |
PROBLEM TO BE SOLVED: To obtain a positive type photosetting-thermosetting resin compsn. useful for forming a resinous insulation layer which does not cause environmental pollution due to the evaporation of an org. solvent and the volume shrinkage of a dry coating, in particular a resinous insulation layer having via holes and to provide a resinous insulation pattern forming method. SOLUTION: The resin compsn. contains (A) a resinous compd. having acid decomposable ester groups and a wt. average mol.wt. of 500-40,000, (B) a compd. having one ethylenically unsatd. bond in one molecule and also having a group which is decomposed by an acid to form a carboxylic acid, (C) a compd. which generates an acid when irradiated with active energy beams, (D) a photo-radical polymn. initiator and (E) an epoxy resin. The top of a substrate is coated with the compsn. and irradiated with active energy beams to form a coating and this coating is selectively irradiated with active energy beams having a shorter wavelength than the above active energy beams. After heating, the irradiated part is removed by development and the unirradiated part is cured by heating to form the objective resinous insulation pattern. |
