| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable semiconductor wafers arranged with their front surfaces faced, in the same direction to be easily rearranged, so as to bring their rear surfaces into contact with each other keeping high workability without causing any damage to the wafers. SOLUTION: A rearranging magazine 3 is kept confronting a transfer magazine 7 where semiconductor wafers 1 are housed with their front surfaces 1a faced in the same direction, even or odd-numbered semiconductor wafers 1 out of the semiconductor wafers 1 housed in the transfer magazine are sent into the rearranging magazine 3. Then, the rearranging magazine 3 is turned over upside down to turn back the semiconductor wafers housed in the magazine 3, and then the residual semiconductor wafers 1 in the transfer magazine 7 are sent into the rearranging magazine 3 so as to overlap the semiconductor wafers 1 which are previously housed.</p> |
