| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly general-purpose universal contact sheet on which a large number of semiconductor devices of different specifications can be mounted. SOLUTION: A plurality of lead wire patterns LU, LD, LR, LL that can be connected to one lead terminal of a QFP semiconductor device 100 are formed. In other words, the lead wire patterns LU, LD, LR, LL that are less wide than the lead terminal are formed with pitches smaller than the lead terminal pitches. At this time, the width of the lead wire patterns LU, LD, LR, LL is not larger than 1/3 and not less than 1/20 than that of the lead terminal.
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