| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for bonding an integrated circuit quickly to a linger part for bonding. SOLUTION: An integrated circuit 3 is mounted on a frame 1 made of a thin metal plate and having a plurality of partially punched finger parts for bonding 1a. The apparatus comprises a heating member 10 having a heating head 11 provided with a central hole 12 in which a die 13 is set movably up and down. The die 13 presses the stopping part of the heating head 11 by means of a compression spring 15 and projects from the top face of the heating head 11 under nonoperating state. During bonding operation, a counter die 19 presses the integrated circuit 3 against the die 13. Since the integrated circuit 3 is heated through direct contact wish the die 13, the time required for reaching a bonding temperature of 300 deg.C-400 deg.C is shortened significantly as compared with conventional case.
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