| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which an input terminal (bonding pad) can be adjusted to have a specified capacitance without needing a large area, increasing manufacturing process, and enlarging delay in an input signal. SOLUTION: This semiconductor device consists of a first input protective resistor 101 for preventing electrostatic breakdown which is connected with a bonding pad, an input circuit part 102 connected with the bonding pad through the first protective resistor, a second input protective resistor 107 for preventing electrostatic breakdown which is connected with the bonding pad, and elements 104, 105 for adjusting input terminal capacitance which are connected with the bonding pad through only the second input protective resistor out of the first and the second input protective resistors.
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