| 摘要 |
PROBLEM TO BE SOLVED: To prevent liquid resin from leaking through a gap between a circuit board and a frame member by pasting the major surface of the frame member onto one adhesive face of a both-sided adhesive tape, parting the other adhesive face onto the board surface while surrounding a board part and then injecting liquid resin into the frame member and eventually curing the resin. SOLUTION: A both sided adhesive tape 5 is formed into annular square shape which is substantially identical to the end face of a frame member 4 and one end face, i.e., major face 6, of the frame member 4 is pasted onto the adhesive tape 5. Subsequently, an adhesive protective sheet on the other side of the adhesive tape 5 is then peeled off to expose the adhesive face which is then placed on the board surface 7 while surrounding a board part 2 mounted on a circuit board 1 thus pasting the frame member 4 fixedly to a specified position of the board surface 7. Thereafter, liquid resin is dripped into the secured frame member 4 and cured thus molding the board part 2.
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