发明名称 SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the size of a substrate treating device. SOLUTION: A substrate treating device is constituted by arranging in a straight live liquid chemical treating units 2 and 4 which treat substrates 1 to be treated with liquid chemicals, treating units 3, 5, and 6 which rinse the substrates 1 with water, and a treating unit 7 which dries the substrates 1, and the substrates 1 are held vertically in the units 2-7. In addition, the device sprays a treating medium on the front and rear surfaces of the vertically held substrates 1, from the nozzles 2a-7a of each unit 2-7 in the unit 2-7.
申请公布号 JP2000031106(A) 申请公布日期 2000.01.28
申请号 JP19980200127 申请日期 1998.07.15
申请人 SONY CORP 发明人 AIBA TAKESHI;NISHIZAKI MITSUHIRO;KOJIMA AKIRA
分类号 B08B3/02;H01L21/304;(IPC1-7):H01L21/304 主分类号 B08B3/02
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