| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip stack package in which short electrical connecting routes are formed for connecting semiconductor chips to external devices and the connecting length between the semiconductor chips is also made shorter. SOLUTION: A chip stack package is provided at least with two or more semiconductor chips 102 and 104 on both side faces of which bonding pads are arranged, in which grooves are formed vertically through the bonding pads, and which are arranged in the vertical direction; a plurality of lead frames 108 which are inserted into the grooves of the chips 102 and 104 and electrically connect the bonding pads to each other; and a sealing agent 116 which molds the whole body of the package in such a way that only the outside connecting sections of the lead frame 108 are exposed. |
