| 摘要 |
<p>PROBLEM TO BE SOLVED: To omit transferring process to a ultraviolet irradiation device by carrying out adhesive sheet sticking process to a semiconductor wafer and ultraviolet irradiation process to an adhesive sheet in the same machine, by mounting a ultraviolet irradiation device for casting ultraviolet ray on an adhesive sheet after being sticked to a semiconductor wafer. SOLUTION: A wafer mounter has a mounting stand 1, a roller 2 for pressing an adhesive sheet 5 to a semiconductor wafer 4 mounted on the mounting stand 1, and a ultraviolet irradiation device 3 for casting ultraviolet ray on the adhesive sheet 5. In adhesive sheet sticking process to the semiconductor wafer 4, after the adhesive sheet 5 is mounted on the semiconductor wafer 4 on the mounting stand 1, the adhesive sheet 5 is pressed to the side of the semiconductor wafer 4 by the roller 2. In ultraviolet irradiation process to the adhesive sheet 5, the adhesive sheet 5 is irradiated by ultraviolet ray by the ultraviolet irradiation device 3 after sticking process. Adhesive sheet sticking process to the semiconductor wafer 4 and ultraviolet irradiation process to the adhesive sheet 5 can be carried out in the same machine in this way.</p> |
