| 摘要 |
PROBLEM TO BE SOLVED: To prevent such illegal action as decoding of an integrated circuit pattern and forging stored information, etc., which are performed by projecting an infrared light from the rear surface side of a semiconductor substrate, related even to such semiconductor device as comprising (a) a thin semiconductor substrate, (b) a semiconductor substrate cut to chips, (c) a semiconductor substrate which is easy to cut/polish, etc. SOLUTION: Related to an IC chip where an integrated circuit 2 is formed on a main front surface side of a semiconductor substrate 1, a part or the entire region of the rear surface of the semiconductor substrate 1 which corresponds to the integrated circuit 2 is covered with a protective film, while the protective film comprises a polishing agent (boron nitride particle) and a binder which allows the polishing agent to stick to the semiconductor substrate 1. The polishing agent is at least 1/10 of the sickness of the semiconductor substrate 1 while having a particle size equal to the thickness of the semiconductor substrate 1 or less, with a hardness higher than the semiconductor substrate 1. |
