| 摘要 |
PROBLEM TO BE SOLVED: To lower a contact resistance and stabilize it, to cause little adhesion and cohesion, and to reduce abrasion by friction, by forming an AuC film on the surface of a contact base material of Au and Au alloy or Ag and Ag alloy by spattering. SOLUTION: In a contact material, a C content in an AuC film is preferably 0.01-1 wt.%. If it is less than the lower limit, adhesion and cohesion are easily caused, and if it exceeds the upper limit, a contact resistance gets high and unstable. The Vickers hardness of the AuC film is preferably 100-200 HV. If it is less than the lower limit, adhesion and cohesion are easily caused, and if it exceeds the upper limit, the constant resistance gets high and unstable. In addition, the thickness of the AuC film is preferably 1-10μm. If it is less than the lower limit, the life of the contact gets short in terms of make break frequency, and even if it exceeds the upper limit, no further enhancement of its function is expected. The AuC film having uniform and dense structure throughout the entire surface can be obtained by using a composite target material formed by pasted by Au and C for spattering.
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