| 摘要 |
PROBLEM TO BE SOLVED: To increase the peeling strength of a pad by forming a conductive leader pattern having at least a plurality of radial types on a circular pad, thereby increasing a connecting area of a wiring board to the pad. SOLUTION: Conductive circular pads 4 are arranged on a printed wiring board 3 which is covered with an insulating resin molding layer, i.e., with a resist 6 layer and are provided with a release hole 15 passing the resist 6 and opposed to the pads 4. A diameter of the hole 15 is larger than that of the pad 4, and a surface except the hole 15 is covered with the pad 4 as the resist 6. A leader pattern 7 for reinforcing a conductive material is formed at the pad 4 for increasing the connection area to the board 3. Thus, a connecting strength of the pad to the board can be improved.
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