发明名称 MOLDED WIRING BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To prevent the deterioration or the like of an insulating performance by providing a hole in a metal frame embedded in a resin, and connecting upper and lower resins of the frame via the hole in a bridge girder state, thereby eliminating a peel off between the frame and the resins or warpages or cracks of the molding resin. SOLUTION: When a metal frame 5 is embedded in a resin 6, the frame 5 is not only resin molded at its outer periphery but also the resin 6 is introduced into a hole 7 of the frame 5, and upper and lower resins 6 of the frame 5 are connected in a bridge girder state. Thus, adhesive properties of the frame 5 with the resins 6 are enhanced, and peel off therebetween is eliminated. When the frame 5 is long, a stress of an expansion or a contraction of the frame 5 is dispersed via a part 6a, in which the resins 6 are connected in a bridge girder state to a part of the hole 7 of the frame 5 to prevent local stress concentration, and warpages or a cracks of the resins 6 are obviated. As a result, deterioration of an insulating performance is scarcely takes place.
申请公布号 JP2000031606(A) 申请公布日期 2000.01.28
申请号 JP19980211857 申请日期 1998.07.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKADA TOMOYUKI;HORII MASATOSHI
分类号 H05K1/02;H05K3/00;H05K3/20;(IPC1-7):H05K1/02 主分类号 H05K1/02
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