| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a laminated structure and a method for manufacturing a substrate for a semiconductor element, by which the manufacturing cost can be reduced and the wiring density can be increased. SOLUTION: A method for manufacturing a substrate for mounting a semiconductor element includes a base metal arranging step for providing base metal foil 21 which becomes a base on the surface 20a of a jig 20 having surface flatness, a laminating step for forming thin film metallic conductor layers 24A and 24B and insulating layers 22A and 22B on the foil 21 through a photolithography process, and an outside connecting terminal forming step for removing the jig 20 after the laminating step and, at the same time, forming outside connecting terminals 29 by patterning the foil 21.
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