| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate treating device without watermarks which does not increase the number of processes and can suppress the steep rises in its device unit price and running cost. SOLUTION: In a semiconductor substrate treating device The surface of a substrate 3 to be treated with ultraviolet rays is irradiated from a plurality of ultraviolet lamps set up in the treating chamber 1 of a wet etching treatment system, while the substrate is wet-etched and rinsed with pure water. As a result, the wettability of the surface of the substrate 3 becomes hydrophilic, and the occurrence of watermarks is suppressed because the surface of the substrate 3 is activated.
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