MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE

摘要

PROBLEM TO BE SOLVED: To transfer data at high speed, by stacking first and second lead frames, providing a semiconductor integrated circuit chip on the second lead frame, and packaging the first and second lead frames with the semiconductor integrated circuit chip to form a signal bypass line and a lead. SOLUTION: Related to a semiconductor integrated circuit package 1, a signal bypass line 3, a die pad 2 provided on a signal bypass line 4, semiconductor integrated circuit chip 5 provided on the die pad 2, and a lead 4 provided to face the signal bypass line 3 are sealed with a mold material 9. The signal bypass line 3 is electrically insulated from the die pad 2 by an insulator. A pad 7 is provided on the semiconductor integrated circuit chip 5. The pad 7 is electrically connected to one of the signal bypass lines 3 which corresponds through a wire 6. Thus, the transfer speed for data is improved.