| 摘要 |
A selective metallization process, comprising mechanical deposition of seeds on a rough substrate surface and then chemical metal plating, is new. Preferred Features: The substrate surface has an average roughness depth of 0.01-100 microns , achieved by sand blasting or plasma or chemical etching. The seed material has a lower hardness than the substrate and consists especially of copper, silver, gold, nickel or palladium. The seeds are applied by linear, vibrational or rotational frictional contact with the substrate surface, especially automatically using a numerically controlled (NC) machine. An exchange reaction may be carried out using a more noble metal, especially silver, gold or platinum, prior to plating. The plated metal may be electrolytically thickened especially with copper, nickel or tin.
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