ELECTROOPTICAL ASSEMBLY GROUP

摘要

The electrooptical assembly group comprises a base module (1) fitted with a heat sink (2) that is selected as a modular system consisting of several alternative heat sinks bodies (2, 4, 50) taking into account the heat dissipation required. The base module (1) includes several electronic components (14, 16) discharging the heat loss caused by operation into a common heat sink (20). The heat sink (20) forms a thermal interface (23) on one of the outer sides (21) of the base module, said interface being connected in a thermally conductive manner to the selected heat sink (2).