| 摘要 |
An automated defect inspection system (10) has been invented and is used to inspect patterned wafers, whole wafers, broken wafers, partial wafers, waffle packs, MCMs, etc. The inspection system is specifically intended and designed for second optical wafer inspection for such defects as metalization defects, such as scratches, voids, corrosion and bridging, as well as diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects. |
