Chip carrier device production for an encased chip arrangement with an electrical test simplifies chip contact mechanism on substrates by a strip conductor structure and through-plating

摘要

The chip carrier device for an encased chip arrangement has a chip carrier (11). One chip contact side (24) has a strip conductor structure with a contact surface extending to one external contact side (25) on the chip carrier and assigned to one chip (18) with through-plating. The chip carrier has other through-plating connected to the strip conductor structure for connecting to test connectors on a test plate.