发明名称 METHOD AND EQUIPMENT FOR READING WAFER ID
摘要 PROBLEM TO BE SOLVED: To provide a small-size, high-speed, and low-cost wafer ID reader having a high performance. SOLUTION: This equipment is constituted of a wafer cassette 2 capable of storing a plurality of semiconductor wafers 1, a light source 3 for wafer detection which casts illumination light 3a for wafer detection on the semiconductor wafer 1, a wafer image pick-up section 4 which picks up an image of the semiconductor wafer 1 in the wafer cassette 2, the main body 5 of a robot which takes out the semiconductor wafer 1 from the wafer cassette 2 and then positions and supports it, a wafer ID pick-up section 7 for picking up the wafer ID of the semiconductor wafer 1, a plurality of light sources for ID detection which can cast illumination light for ID detection on the wafer ID in a plurality of directions and at a plurality of angles, and a recognizing and controlling section 9 which recognizes, by image processing, the state of the semiconductor wafer 1 in the wafer cassette 2 and the wafer ID picked up by the wafer ID pick-up section 7 and controls the light sources for ID detection separately.
申请公布号 JP2000030991(A) 申请公布日期 2000.01.28
申请号 JP19980196907 申请日期 1998.07.13
申请人 HITACHI LTD;HITACHI TOKYO ELECTRONICS CO LTD 发明人 NAGAI HARUO;MORIGUCHI HIROSHI;YAMATANI KAZUHIRO;NAKAMURA SEIGO
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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