| 摘要 |
PROBLEM TO BE SOLVED: To provide the monitoring device which easily conducts overall and precise monitoring for a reflow soldering condition other than a reflow temp. to cope with severe setting and control of a reflow soldering condition required in a micro (reflow) soldering technology. SOLUTION: The monitoring device 10 of a reflow soldering condition, a monitoring part 13 is accommodated in its heat seal box 11, the monitoring part 13 is provided with a thermo couple, as a temp. sensor, a platinum sensor and zirconia sensor. By traveling the monitoring device 10 with loading on a belt conveyer in a reflow furnace at the same state as a state of normal reflow soldering, a profile for not only a reflow temp. but a wind flow rate, wind speed, wind temp. and oxygen concentration is monitored.
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