发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A manufacturing method of semiconductor device is provided to manufacture a flash memory which a floating gate is continuously extended to source and drain areas in reduced processes comparing to prior art. CONSTITUTION: The manufacturing method of semiconductor device comprises: the first step forming a dummy pattern(103a) on the first conduct type semiconductor substrate(101); the second step forming a source(104) and a drain(105) by injecting the second conduct type impurity into prescribed area of the substrate besides the dummy pattern; the third step forming a wiring layer consisted of conductive substance on the source and drain; the forth step exposing the substrate by selectively removing the dummy pattern; the fifth step forming a gate insulation film(102) and a interfacial insulation film(122) on the exposed substrate; the sixth step forming a conductive film on the gate insulation film and interfacial insulation film; the seventh step a floating gate continuous to the source and drain on the gate insulation film and interfacial insulation film by working the conductive film; the eighth step forming a separating insulation film covering the floating gate; and the ninth step forming a control gate.
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申请公布号 |
KR20000006121(A) |
申请公布日期 |
2000.01.25 |
申请号 |
KR19990021802 |
申请日期 |
1999.06.11 |
申请人 |
NEC CORPORATION |
发明人 |
TSKUIMASARU |
分类号 |
H01L21/8247;H01L21/28;H01L27/115;H01L29/423;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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