| 发明名称 |
Holding a polishing pad on a platen in a chemical mechanical polishing system |
| 摘要 |
<p>The disclosure relates to a chemical mechanical polishing apparatus which includes a rotatable platen (30) having a surface for receiving a polishing pad (32) and a passageway (220, 232) passing therethrough to the surface. A pump (200) evacuates air from the passageway to hold the polishing pad against the surface of the platen. <IMAGE></p> |
| 申请公布号 |
SG70017(A1) |
申请公布日期 |
2000.01.25 |
| 申请号 |
SG19970002446 |
申请日期 |
1997.07.11 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BARTLETT, WILLIAM, R.;SHENDON NORM |
| 分类号 |
B24B37/16;B24D9/10;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
