POLISHING EQUIPMENT PROVIDED MATERIAL controlling SURFACE OF POLISHING PAD AND METHOD OF controlling SURFACE OF POLISHING PAD

摘要

PURPOSE: Polishing equipment is provided to improve the rate of operation in polishing a wafer. CONSTITUTION: In the polishing equipment, a polishing pad is fixed on top of a platen. The platen is rotated. A wafer and a wafer for controlling are supported by a carrier. The carrier is rotated. The carrier is went down on the top of the platen to polish the polishing pad. A dressing device is placed around the platen. A loading cup and a unloading cup are fixed on the path which the carrier is moving. A loader and a unloading unit is placed around the loading cup and unloading cup. The wafer for controlling is used to control the surface of the polishing pad.