| 摘要 |
PURPOSE: The wire bonding method is provided to improve the safe wire loop shape and the high shape maintenance. CONSTITUTION: The wire bonding method comprises the step of: connecting a first bonding spot and a wire end; performing reverse act which move the wire opposite direction to a second bonding spot after raise a capillary. Raising upwardly further after tilting the capillary to the direction of a second bonding spot. Performing reverse act at least one to the opposite direction of the second bonding spot. Raising upwardly the capillary and connecting the wire to the second spot. |
