| 摘要 |
PURPOSE: A polish composition having a high polish and remove speed is provided to form a very smoothly polished surface, not generating the groove of a mixed material on polishing a low resistant wafer. CONSTITUTION: A silicon wafer polish composition is composed with:water, a polisher such as a dioxide silicon and an adding material including more than one compound among a hydroxide and a carbonate and a carbonate hydrogen of an alkali metal, an ammonium salt, peroxides and peroxide acid compound.
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