| 摘要 |
PURPOSE: Polishing equipment is provided to maintain pressing pressure constantly and to control pushing pressure. CONSTITUTION: The polishing equipment comprises: mount plate fixed a polished object, mount head placed over the mount plate, and hollow structure placed between the mount plate and the mount head which is formed flatted plane. Since the depth of the hollow structure is changed, the pressure the hollow structure press mount plate is uniform. As a result, a wafer is polished uniformly without irregularity. |
