发明名称 COMPOSITE MATERIAL
摘要 PROBLEM TO BE SOLVED: To improve the joining strength of a base body to a compound by joining the base body consisting of Cu or the alloy with the compound through a joined layer composed of a mixed layer of Cu or the alloy with the compound and having a specific thickness. SOLUTION: A composite material composed of the Cu or Cu alloy base body and the compound, which are joined through the joined layer having 50-1000μm thickness, is obtained by allowing a mixed body of elemental powder mixed in a composition ratio to enable to form an intermetallic compound to contact with the base body to form a contact member and pressurizing the member under 30-1,000 kgf/cm2 after or at the same time that voltage is applied directly to the member at 0.3-40 V/cm max. voltage for 0.1-100 sec. In the energizing condition, a part of the mixed body of the elemental powder reacts and the mixed body is heated by itself by the heat of reaction generated at this time to be synthesized into the compound for a short time. As the mixed body, a mixed body of one or more kinds among the intermetallic compound, a carbide, a borate, a silicide and a nitride is suitably used.
申请公布号 JP2000026905(A) 申请公布日期 2000.01.25
申请号 JP19980197516 申请日期 1998.07.13
申请人 MITSUBISHI MATERIALS CORP 发明人 KAWASE KINYA;MORIMOTO KOICHIRO
分类号 B23K20/00;B22F3/10;B22F3/105;B22F3/14;B22F3/23;B22F7/08;B23K103/16;(IPC1-7):B22F7/08 主分类号 B23K20/00
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