| 摘要 |
PURPOSE: Semiconductor device is provided to improve a yield, a productivity, and a reliability. CONSTITUTION: In the semiconductor device to seal up two semiconductor chips with a grease sealing material using two lead frames, wide width portion is extended to width direction of dambar, one side width of the dambar is narrow than the other side width of the dambar, and the two lead frames are joined. As a result, crack of semiconductor is prevented. |
